Manufacturing capability

Ceramic Micro Machining: Micro Holes and Narrow Slots

Micro features in technical ceramics, where feature size rather than overall part size defines the manufacturing difficulty.

A machine tool set up on the shop floor.

Capability

Micro-feature capability

Figures below are the capability the shop is measured on. They are feature-specific, not a general tolerance.

0.003 mm
Hole Diameter Tolerance
0.0005 mm
Roundness
0.002 mm
Parallelism
0.2 mm
Minimum Slot Width
Ra 0.02 µm
Surface Roughness

Capabilities depend on material, geometry, feature size and finishing requirements. Critical dimensions are reviewed against the drawing.

Small features in hard material

Micro machining on ceramic is limited by tool stiffness and by edge chipping, not by the machine’s positioning resolution.

Micro-feature capability and the constraint behind it
FeatureHow it is producedConstraint
Minimum slot widthDown to 0.2 mmTool diameter sets the floor
Micro holesDiamond micro drillingAspect ratio and entry angle
Micro holes below the tool rangeFemtosecond laser drillingDepth-to-diameter ratio and wall taper
Thin wallsSub-millimetre sectionsSupport during machining
Micro pocketsFeasible with fine toolingDepth-to-width ratio
Edge qualityChipping risk rises as features shrinkEdge break specification

Why micro features need a different plan

Tool deflection and heat concentration scale badly as feature size falls, so the sequence changes completely compared with a larger part in the same material.

  • Shallow passes and reduced feed to control edge chipping
  • Tool entry planned to avoid breakout on unsupported edges
  • Feature order arranged so each one is still supported
  • Coolant and cleaning planned around the small features
  • Measurement method agreed before machining, not after
ENGINEERING NOTEA micro feature is usually the last thing machined, because everything before it removes material that would otherwise support the tool.
LIMITSlot width and hole diameter cannot be reduced indefinitely. Below a certain size the tool cannot survive the cut in alumina or silicon carbide, and a drawing callout does not change that physical limit.

Measuring features this small

Optical and video measurement is used rather than contact probing, which cannot enter these features without risk.

Ceramic parts with small drilled and slotted features machined into them
Micro-feature parts
Video measuring system for micro features
Video measurement
Engineer taking a measurement on a video measuring system at the metrology bench
Optical inspection

Findings that are specific to micro features

At this scale the limit is rarely the machine. It is the tool, the entry edge and the wall left standing beside the feature. These are the findings that come back from review on parts this small.

DFM findings on micro features
FindingWhy it happensWhat helps on the drawing
Micro hole with a tight position toleranceEntry angle and tool drift dominate at this scale, not the positioning resolution of the machineTolerate the position relative to the nearest datum feature rather than to a distant face
Aspect ratio beyond the tool rangeThe drill cannot clear chips, so the hole wanders and the edge breaks out at the far sideState the aspect ratio. Above the tool limit the route changes to laser drilling, which is quoted differently
Sharp entry edge on a micro holeThe edge chips on entry, and the chip is larger than the feature itselfSpecify a chamfer, or accept an agreed edge criterion
Slot width set at the tool limitThe tool diameter sets the floor, so tool wear is inside the tolerance rather than outside itSet the width and accept the tolerance the tool can hold, rather than the reverse
Thin wall between two micro featuresThe wall deflects during machining and again during measurementIncrease the wall where the function allows, or accept a looser tolerance and a measurement fixture
Surface finish specified inside a micro featureThe instrument has to reach the feature, which is not always possibleState the finish only where it is functional and reachable

Femtosecond laser drilling for micro holes

Korecera operates in-house femtosecond laser processing equipment for selected precision ceramic micro-feature applications. Feasibility depends on material, geometry, thickness and feature requirements. Where a hole is too small, too deep or too hard for a diamond tool to survive the cut, the material is removed by an ultrashort-pulse laser instead. Ultrashort-pulse laser processing can reduce the heat-affected zone relative to longer-pulse laser processes, but taper, recast, microstructure effects, edge condition and subsurface damage remain process- and material-dependent.

Femtosecond laser drilling against diamond drilling
ConsiderationFemtosecond laserDiamond drilling
Material hardnessLess dependent on conventional cutting-tool hardness limits; absorption, composition, thickness and feature geometry still affect process capabilityTool wear rises sharply with hardness
Heat inputReduced heat-affected zone relative to longer-pulse laser processes; the remaining thermal and microstructural effects depend on parameters and materialMechanical cutting, with coolant controlling the temperature
Very small diametersReaches sizes below the practical tool rangeLimited by the smallest tool that survives the cut
Deep, small holesAchievable at depth-to-diameter ratios a drill cannot holdAspect ratio limited by tool stiffness and swarf removal
Wall conditionTaper and wall finish are process-dependent and are stated after reviewStraight wall with a ground finish
Typical applicationFew difficult holes, or holes in the hardest gradesAny hole the tool can drill economically
WHEN IT IS USEDTypically for a hole a drill cannot reach, for a hard grade such as silicon carbide or silicon nitride, or where hole-wall condition and subsurface integrity are critical – subject to the process- and material-dependent effects reviewed above.
WHAT TO PUT ON THE DRAWINGHole diameter, depth, the taper that is acceptable, and whether the entry and exit edges must be free of chips. Those four items decide whether the feature is practical and how it is inspected.
LIMITLaser drilling is a complementary route, not a replacement for grinding. A hole that can be drilled economically is still drilled; the laser is reserved for features the tool cannot hold.

The part and the process

A white ceramic disc beside a brightly coloured semiconductor wafer
A ceramic disc beside a wafer, the pairing this material serves.
A vertical measuring instrument for height and form checks, set up in the inspection room
Height and form measurement, set up in the inspection room.

Frequently asked

What is the smallest slot you can produce?

The confirmed minimum slot width is 0.2 mm. Whether it is achievable on a given part depends on depth, material and how close the slot sits to an edge.

Do you machine micro holes with a laser?

Yes. Micro holes below the practical diamond-tool range, and holes in the hardest grades such as silicon carbide or silicon nitride, are produced on our in-house femtosecond laser processing equipment within the quoted process route. Hole diameter, depth, acceptable taper and edge condition are agreed from the drawing before production, because those items – not the laser alone – decide what the process can hold.

Can micro features be measured on a CMM?

Contact probing is not suitable for the smallest features. Video and optical measurement is used, and the method is agreed with you before production because it defines what the report can show.

Do micro features change the material recommendation?

Sometimes. A material that is fine for a large part can chip excessively at micro scale, so the selection may move towards a finer-grain grade.

How do I specify edge quality?

State the maximum acceptable edge chip or break, or reference an edge-break requirement. An unspecified edge is the most common cause of disagreement on micro-machined parts.

Send us the drawing and the requirement

We review manufacturability, tolerance and inspection method before quoting.